Filoform Fill & Seal compound is a high quality, flexible and strong one-component product. The Filoform glueing and sealing compound is based on a hybrid MS-polymer.
After application the compound cures with atmospheric moisture to form a durable, high-levelled elastomer.
Applications for Fill & Seal compound are telecom technique, cable ducts, wall ducts, gastight and watertight sealing for centre plugs and duct plugs. Also used as a glueing and sealing compound in construction and shipbuilding industry.
|Skin hardening||± 10 minutes|
|Hardening||3mm / 24 hours|
|Hardness||55 shore A||DIN 53504|
|Tensile strength||1.7 N/mm||DIN 53504|
|Volume change||< 3%||DIN 52451|
|Shear strength||2.5 N/mm²|
|Operating temperature||+5°C till +40°C|
|Temperature resistance||-40°C till +120°C|
Operation: the surface has to be clean, dust free and grease free, recommended thickness layer 0.5 to 3 mm for elastic gluing.
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